Method for concurrently forming holes for interconnection betwee

Details Method for concurrently forming holes for interconnection betwee Method for concurrently forming holes for interconnection betwee

1995-04-13

1997-03-11

Quach, T. N.

Fishing, trapping, and vermin destroying

437189, 437228, H01L 21283

Patent

active

056101007

ABSTRACT:
In a semiconductor device having conductive paths for electrically coupling a substrate surface with a second conductive/wiring layer, the substrate and the second conductive layer having a first conductive layer therebetween, a second insulating layer separating the first and the second conductive/wiring layers is replaced by a process for forming a protective covering over the patterned and etched first conductive layer. The second conductive layer will provide an electrical contact with the exposed conducting material in the contact holes without the critical patterning and etching process steps typically required when the second insulating layer is formed.

REFERENCES:
patent: 5100817 (1992-03-01), Cederbaum et al.
patent: 5229325 (1993-07-01), Park et al.
patent: 5279989 (1994-01-01), Kim
patent: 5308795 (1994-05-01), Hawley et al.
patent: 5393703 (1995-02-01), Olowolafe et al.

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