Method for completing wire bonds

Details Method for completing wire bonds Method for completing wire bonds

1976-07-12

1978-01-17

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

228 45, 228179, H01R 4302

Patent

active

040683710

ABSTRACT:
Improved wire bonds between circuit points of such apparatus as semiconductor devices and integrated circuit units are accomplished by bonding one end of a wire to one of the circuit points and then paying out from a tool through which the wire is threaded, a length of wire sufficient to form a loop between the first bond point and the second bond point. That having been done, the wire is prevented from paying out of, or back into, the tool while the tool and the wire are lowered to the second bond point where the second bond is completed.

REFERENCES:
patent: 3627192 (1971-12-01), Killingsworth
patent: 3648354 (1972-03-01), Mashino et al.
patent: 3689983 (1972-09-01), Eltzroth et al.
patent: 3747198 (1973-07-01), Benson et al.
patent: 3787966 (1974-01-01), Klossika
patent: 3954217 (1976-05-01), Smith

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