Method for combining die attach and wirebond in the assembly of

Details Method for combining die attach and wirebond in the assembly of Method for combining die attach and wirebond in the assembly of

1990-07-13

1991-11-05

Heinrich, Samuel M.

Metal fusion bonding

With control means responsive to sensed condition

Work-responsive

228102, 228105, B23K 308

Patent

active

050625659

ABSTRACT:
An improved system for the production of semiconductor devices is described. The invention incorporates conventional die attach and wire bond means into a simplified, common machine system. An independently mounted, computer-controlled, television camera system observes, monitors, and controls the operational steps of the die attach wire bond process using a close loop process. The invention serves to increase throughput and yields while reducing variation of the finished product.

REFERENCES:
patent: 4732313 (1988-03-01), Kobayashi et al.
patent: 4862245 (1989-08-01), Pashby et al.
IBM Technical Disclosure Bulletin, "Assembly Technique for Placing Electronic Components on Printed Circuit Wiring Patterns", vol. 31, No. 10, pp. 222-228, 3-1989.

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