Method for combining die attach and lead bond in the assembly of

Details Method for combining die attach and lead bond in the assembly of Method for combining die attach and lead bond in the assembly of

1991-11-04

1992-09-08

Heinrich, Samuel M.

Metal fusion bonding

With control means responsive to sensed condition

Work-responsive

228102, 228105, B23K 308

Patent

active

051450992

ABSTRACT:
An improved system for the production of semiconductor devices is described. The invention incorporates conventional die attach and lead bond means into a simplified, common machine system. An independently mounted, computer-controlled, television camera system observes, monitors, and controls the operational steps of the die attach-lead bond process using a close loop process. The invention serves to increase throughout and yields while reducing variation of the finished product.

REFERENCES:
patent: 5062565 (1991-11-01), Wood et al.

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