Method for collecting a metallic contaminants from a wafer

Details Method for collecting a metallic contaminants from a wafer Method for collecting a metallic contaminants from a wafer

1997-08-20

1999-11-30

Soderquist, Arlen

Chemistry: analytical and immunological testing

Metal or metal containing

436 80, 436 81, 436 83, 436 84, 436174, 436175, 422 99, 422102, 422104, 206710, 211 4118, 134 2, G01N 3300

Patent

active

059941421

ABSTRACT:
A sampling method for collecting metallic contaminants from a surface of a wafer having an oxide film thereon. A sampling vessel comprises a bottom having a concave inner surface and a convex outer surface, a cylindrical wall extending from the edge of the bottom, and a step section having a plane intercepting an arc plane of the cylindrical wall for adapting the orientation flat of the wafer. Sampling liquid containing 0.1 to 10% HF and hydrogen peroxide dissolves the oxide film and collects the metallic contaminants by swinging the sampling vessel on the convex outer surface of the bottom.

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Realize Inc.; "Atomic Absorption Method"; Feb. 1995; pp. 96-97; publisher unknown.

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