Method for coining solder balls on an electrical circuit package

Details Method for coining solder balls on an electrical circuit package Method for coining solder balls on an electrical circuit package

1996-11-08

1998-12-29

Lorin, Francis J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29882, H05K 0300

Patent

active

058535179

ABSTRACT:
A method and apparatus are provided for coining solder balls on an organic electrical circuit package. Generally, this method includes placing a slug on one or more of the solder balls; and applying sufficient pressure for a sufficient period of time on the slug to flatten the surface of the solder balls so as to form planar solder coins. The apparatus includes a press; a ram attached to the press; a platform for receiving the package and a slug placed upon the solder balls.

REFERENCES:
patent: 3953566 (1976-04-01), Gore
patent: 4162572 (1979-07-01), Rozmus
patent: 4482516 (1984-11-01), Bowman et al.
patent: 4705762 (1987-11-01), Ota et al.
patent: 4985296 (1991-01-01), Mortimer, Jr.
patent: 5279711 (1994-01-01), Frankeny et al.
"Low Melt Solder Preform for Chip Attach", Research Disclosure, No. 331, Nov. 1, 1991, p. 872.
"Solder-Height Variation Reduction by Calendaring", IBM Technical Disclosure Billetin, vol. 33., No. 1B, Jun. 1, 1990, pp. 77-78.

Affiliated with

Also associated with

Rating

Method for coining solder balls on an electrical circuit package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for coining solder balls on an electrical circuit package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for coining solder balls on an electrical circuit package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1420282