Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1989-01-27
1991-05-28
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 58, C23C 2600
Patent
active
050194097
ABSTRACT:
A method and apparatus for dispensing a thin coating of a highly viscous encapsulant liquid on to the top surface of a semiconductor device having been inner lead bonded. The coating is dispensed with a controlled thickness and is substantially planar. A liquid encapsulant having optimum thermal, chemical and mechanical properties is selected for protecting the electrical device and which is suitably controlled in an automated liquid dispensed process. The process is directed to various parameters which are required for achieving the desired quality, reliability, and automatic processing capability.
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Sherman Kimberly J.
Wesling Mary A.
Beck Shrive
Dang Vi Duong
Microelectronics and Computer Technology Corporation
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