Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Including integrally formed optical element
Reexamination Certificate
1998-04-07
2001-10-30
Lee, Eddie (Department: 2815)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Including integrally formed optical element
C438S025000, C438S026000, C438S124000, C438S126000, C438S127000
Reexamination Certificate
active
06309902
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a method for covering a semiconductor device with a coating resin, a coating resin and a liquid crystal display device.
BACKGROUND ART
In a liquid crystal display device, liquid crystal is encapsulated between one pair of opposing substrates provided with electrodes, the alignment of the liquid crystal is controlled by controlling an applied voltage to electrodes to modulate light, and thus, visible images, such as numerals, letters, graphics and so forth are displayed on the substrate surface. The voltage applied to electrodes is generally controlled by a driver IC which corresponds to a semiconductor device. If the driver IC and its connecting parts are exposed to moisture, their electrical characteristics may deteriorate.
In general, in order to protect a driver IC and its connective parts from being exposed to moisture, the driver IC and its connective parts are coated with a coating resin. For example, in a COG (Chip On Glass) type liquid crystal panel
1
, as shown in
FIG. 5
, a method for coating a driver IC
2
used therein, its surroundings and exposed transparent electrodes with a coating resin, generally comprises the steps of applying a coating resin R around the driver IC
2
by translating a tube
51
along a substrate
4
as shown by an arrow A while squeezing the coating resin R out of the tube
51
which contains a liquid coating resin, and then drying the coating resin R after a period of time.
The conventional method for resin coating, however, requires a long time to dry and solidify a coating resin, resulting in a significantly low productivity. Also, a unit for squeezing a given volume of the coating resin R out of the tube
51
and a unit for translating the tube
51
are required, resulting in a high cost of equipment.
The present invention has been completed in view of the foregoing problems and it is an object of this invention to provide a method for simply and quickly covering a semiconductor device used for a liquid crystal display device with a resin.
DISCLOSURE OF INVENTION
In order to achieve the above-mentioned object, a method for covering a semiconductor device with a resin, in accordance with this invention, comprises the steps of forming a layered coating resin, placing the coating resin around the semiconductor device, and curing the coating resin to cover the semiconductor device.
As a coating resin, a coating resin which is curable through a chemical reaction by heating, for example, an olefinic copolymer resin may be used, and in such a case, the coating resin can be cured by heating at temperatures of approximately from 60° C. to 80° C. for approximately 30 minutes, and then it can be adhered to an adherend by cooling at room temperature for approximately 10 minutes. As the environmental temperature increases, the coating resin softens so that its corners are smoothly rounded, and then, it will have a predetermined hardness by leaving it to stand at room temperature for a given time. Once it is cured, it will not melt by heating at a temperature of approximately 80° C., more specifically it will not melt at temperatures of 120° C. to 140° C.
Preferably, a coating resin to be used may be selected appropriately so that the heating temperature is set at approximately 80° C. because it is preferable to protect the liquid crystal from being exposed to a high temperature when this method is applied to a liquid crystal display device.
In the present invention, an UV (ultraviolet) curing type resin may be used as an alternative to the above-mentioned thermoset resin. The ultraviolet curing type resin is cured when irradiated with ultraviolet rays, and generally it is cured by ultraviolet energy of approximately 1,000 mJ.
In the resin coating method having the above composition, in accordance with the present invention, the mechanical working conducted by a worker or machinery includes only placing the coating resin on the semiconductor device, and the current work of applying a coating resin onto a substrate is no longer required. Accordingly, the workflow is simplified, and moreover no particularly complicated unit is required.
Since the liquid coating resin is not cured by drying, but the coating resin is cured either by heating through a chemical reaction or by employing a curing treatment such as ultraviolet curing, the coating resin can be cured around the semiconductor device in a very short time.
It is preferable to form a through-hole or concavity on the coating resin so that a semiconductor device can be placed. In such a manner, the coating resin is always automatically placed on a fixed position including the semiconductor device, and thus there is no deviation from the position of the coating resin on the semiconductor device.
The resin coating method in accordance with the present invention can be applied to a liquid crystal display device having any configuration. As described in Claim
6
, however, this method is particularly beneficial to what is called a COG-type liquid crystal display device in which a semiconductor device is directly fixed onto a glass substrate, because the coating resin easily adheres to the glass substrate.
Also, in accordance with the present invention, the coating resin for covering the semiconductor device is formed as a layer. Preferably, the coating resin has a through-hole or concavity so as to place the semiconductor device.
Also, the liquid crystal display device, in accordance with the present invention, comprises one pair of substrates facing each other with liquid crystal enclosed therebetween and a semiconductor device which is directly joined to at least one substrate, wherein the coating resin is formed as a layer, the coating resin is arranged around the semiconductor device, and the semiconductor device is coated by curing the coating resin.
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James J. Licari, Plastic Coatings for Electronics, 1970, pp. 125.*
Charles A. Harper, Electronic Packaging and Interconnection Handbook, 1991, pp. 1.3-1.7.
Harness & Dickey & Pierce P.L.C.
Lee Eddie
Richards N. Drew
Seiko Epson Corporation
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