Method for coating semiconductor device using droplet...

Details Method for coating semiconductor device using droplet... Method for coating semiconductor device using droplet...

2006-01-09

2009-08-04

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S026000, C438S029000

Reexamination Certificate

active

07569406

ABSTRACT:
Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the matrix material to the surface of the semiconductor device, with each of said nozzles having an opening for the matrix material to pass. The opening has a diameter wherein the diameter of the phosphor particles is less than or approximately equal to one half the diameter of the opening. The phosphor particles are also substantially spherical or rounded. The nozzles are typically arranged on a print head that utilizes jet printing techniques to cover the semiconductor device with a layer of the matrix material. The methods and systems are particularly applicable to covering LEDs with a layer of phosphor materials.

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patent: 7393081 (2008-07-01), Maekawa et al.
patent: 2003/0083203 (2003-05-01), Hashimoto et al.
patent: 1198016 (2001-10-01), None
Nichia Corp. White LED, Part No. NSPW312BS, “Specifications for Nichia White LED, Model NSPW312BS” pp. 1-14, 2004.
Nichia Corp. White LED, Part No. NSPW300BS, Specifications for Nichia White LED Model NSPW300BS, pp. 1-14, 2004.

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