Method for coating semiconductor components on a dielectric film

Details Method for coating semiconductor components on a dielectric film Method for coating semiconductor components on a dielectric film

1989-03-31

1990-04-03

Robinson, Ellis P.

Coating processes

Electrical product produced

427209, 427210, 427 96, 427387, 437211, 437219, 437228, 437207, 29759, 29827, 29841, 26427213, 26427214, 26427217, 428131, 428189, 428901, 428906, 206330, 206328, 357 70, 357 80, H01L 2156, H01L 2196, H01L 2198, H01L 2330

Patent

active

049139304

ABSTRACT:
Apparatus for applying a coating to semiconductor chips mounted within apertures in a dielectric film. The film containing the semiconductor chips and input-output connectors is fed from a reel past an applicator for applying the coating on one side of the chips. After passing through a curing chamber, the film passes about a substantially square sprocket so as to reverse the direction of travel. The sprocket is of such a dimension that the film bends on a line between each individual chip or a selected group of chips. The strip then passes by another applicator for coating the other side of the chips. After passing through the curing chamber, including a substantially square sprocket, the film is wound on a driven sprocket. The coating may be a silicone composition, an epoxy resin, or a urethane composition.

REFERENCES:
patent: 3908040 (1975-09-01), Dauksys
patent: 3983265 (1976-09-01), Letoffe
patent: 4079509 (1978-03-01), Jackson et al.
patent: 4143456 (1979-03-01), Inoue
patent: 4163082 (1979-07-01), Romenesko
patent: 4293397 (1981-10-01), Sato et al.
patent: 4327369 (1982-04-01), Kaplan
patent: 4508758 (1985-04-01), Wong
patent: 4586997 (1986-05-01), Lee
patent: 4694040 (1987-09-01), Hashimoto et al.
patent: 4720431 (1988-01-01), Wong

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