Method for coating of polyimide by electrodeposition

Details Method for coating of polyimide by electrodeposition Method for coating of polyimide by electrodeposition

1975-10-21

1977-04-26

Kaplan, G. L.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

20412975, 204181, 428675, C25D 1306, B23P 300

Patent

active

040198774

ABSTRACT:
A method of coating a copper substrate comprises the steps of: anodically microsmoothing the copper substrate in an acid bath to provide a substantially smooth surface; electrocoating the microsmoothed substrate with a pin hole free nickel film having a thickness of between about 2.5 microns to about 12.5 microns; single step, non-aqueous electrocoating the microsmoothed, nickel coated substrate with a pin hole free polyamic acid polymer, and curing the polyamic acid coating to form a polyimide film free of copper ion contamination.

REFERENCES:
patent: 2725353 (1955-11-01), Strobel
patent: 2753301 (1956-07-01), Bersworth et al.
patent: 3547788 (1970-12-01), Tanaka et al.
patent: 3846269 (1974-11-01), Martello et al.
A. Kenneth Graham, "Electroplating Engineering Handbook", 2nd edition, p. 197, (1962).
Frederick A. Lowenheim, "Modern Electroplating", pp. 261-262, (1963).

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