Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1986-08-27
1990-03-27
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427185, 427195, 118DIG5, B05D 314
Patent
active
049119494
ABSTRACT:
A method of applying a synthetic resin layer to an outer surface of a metal part, comprising heating the metal part to a temperature higher than a melting point of a synthetic resin, embedding the heated metal part within a powdered mass of the synthetic resin, thereby melting a portion of the powdered mass surrounding the outer surface of the heated melt part, holding the heated metal part within the powdered mass for a time period sufficient to permit the molten portion of the powdered mass to be coated on the outer surface of the heated metal part as the synthetic resin layer, removing the metal part coated with the synthetic resin layer from the powdered mass, and maintaining the removed metal part at a temperature higher than the melting point and lower than a thermal decomposition point of the synthetic resin, to hold the deposited resin layer in a molten state for a suitable length of time, in order to allow the escape of possibly entrapped air from the resin layer.
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Iwase Takahiro
Kabayashi Nobuo
Masuda Naofumi
Mochizuki Hiroyuki
Tamaki Shigenori
Bashore Alain
Beck Shrive
Toyota Jidosha & Kabushiki Kaisha
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