Coating processes – Centrifugal force utilized
Reexamination Certificate
2005-05-10
2005-05-10
Jolley, Kirsten (Department: 1762)
Coating processes
Centrifugal force utilized
C427S299000, C427S352000, C427S425000, C118S052000, C118S320000, C438S780000, C438S782000
Reexamination Certificate
active
06890595
ABSTRACT:
A method for coating low viscosity materials onto a wafer to form a uniform film. After a wafer is rotated at a first rotation speed, coating solution is dispensed onto the wafer. The wafer is decelerated to a second rotation speed at a first deceleration rate to spread the coating solution. Next, the wafer is slowly decelerated to a third rotation speed at a second deceleration rate considerably lower than the first deceleration rate, so the coating solution reflows to the center of the wafer. The wafer is then quickly accelerated to a fourth rotation speed at a third acceleration rate larger than the first deceleration rate to spread the coating solution again.
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Chang Wen-Chi
Lee Ai-Yi
Jolley Kirsten
Ladas & Parry LLP
Nanya Technology Corporation
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