Method for coating components or shapes by cathode sputtering

Details Method for coating components or shapes by cathode sputtering Method for coating components or shapes by cathode sputtering

1991-09-05

1994-01-11

Nguyen, Nam

Chemistry: electrical and wave energy

Apparatus

Coating, forming or etching by sputtering

20429816, 20429818, 20429826, C23C 1434

Patent

active

052777782

ABSTRACT:
Coating of components and shapes by cathode sputtering of target material of a first cathode system (6) with concentration of a first discharge space (plasma cloud) in the vicinity of the target surface by a spatially closed magnetic field (plasma trap) opposite the target (12). The field strength is reduced in front of the target surface by an additional magnet associated with a lateral boundary of the target.

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patent: 4880515 (1989-11-01), Yoshikawa et al.
patent: 5006219 (1991-04-01), Latz et al.
patent: 5022978 (1991-06-01), Hensel et al.
patent: 5069772 (1991-12-01), Fritsche et al.

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