Method for coating a substrate with a coating solution

Coating processes – Centrifugal force utilized

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4273855, 427231, B05D 312

Patent

active

057730830

ABSTRACT:
A method for coating a substrate with a coating solution. In a first step (31), a semiconductor wafer is placed on a turntable. In a second step (32), the substrate is spun at a high speed and a coating solution is dispensed onto the substrate. In a third step (33), the turntable is spun at a low speed and additional coating solution is dispensed onto the substrate.

REFERENCES:
patent: 4748053 (1988-05-01), Okada
patent: 5066616 (1991-11-01), Gordon
patent: 5395803 (1995-03-01), Adams
patent: 5405813 (1995-04-01), Rodrigues

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