Method for coating a substrate

Chemistry: electrical and wave energy – Processes and products – Vacuum arc discharge coating

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204192R, 204192D, 204298, C23C 1500

Patent

active

040466590

ABSTRACT:
An improved method is described for coating a substrate in a system in which an insulating layer is also formed on one portion of a conductive target plate which is bombarded with ions. One such system is a reactive sputtering system in which a predetermined partial pressure of a reactive gas is established between a reactive metal target plate and the substrate. The bombarding ions are formed in a glow discharge plasma which may be magnetically confined. In accordance with the invention, an ac potential is applied to the target plate in order to prevent arcing which is believed due to the dielectric breakdown of the insulating layer.

REFERENCES:
patent: 3336211 (1967-08-01), Mayer
patent: 3655438 (1972-04-01), Sterling et al.
patent: 3878085 (1975-04-01), Corbani
patent: 3956093 (1976-05-01), McLeod
P. D. Davidse, "Theory and Practice of RF Sputtering," Vacuum, vol. 17/No. 3, Aug. 26, 1966, pp. 139-145.
Chapin, "The Planar Magnetron," Vacuum Technology, Jan. 1974, pp. 37-40.
Vratny, "Deposition of Tantalum and Tantalum Oxide by Superimposed RF and DC Sputtering," J. Electrochem. Soc., Solid State Science, pp. 505-507, May 1967.
Koenig et al, "Application of RF Discharges to Sputtering" by Koenig et al, IBM J. Res. & Dev., vol. 14, No. 2 (Mar. 1970), pp. 168-170.

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