Method for co-extrusing dough mass with particulate matter in th

Details Method for co-extrusing dough mass with particulate matter in th Method for co-extrusing dough mass with particulate matter in th

1984-07-12

1986-04-01

Weinstein, Steven

Food or edible material: processes, compositions, and products

Filling cavity in edible solid preform with edible material

Dough type preform

4251331, A21D 1300, A21G 300

Patent

active

045797447

ABSTRACT:
A continuous co-extruded food product is formed having dissimilar inner and outer portions wherein the inner portion is enveloped by the outer portion and the outer portion is a dough containing particulate material such as chocolate chips. The product is formed by an inner extrusion port being recessed a distance d from an outer extrusion port with the distance d being sufficient for permitting particulate material in the outer dough portion to pass through an exit passage between the inner and outer extrusion ports without clogging or agglomeration. Turbulence is induced in the outer dough portion which envelops the inner portion thereby causing the particulate material to tumble whereby at least a portion of the particulate material partially penetrates the exterior surface of the outer dough portion enveloping the inner portion. Dough is removed from the surface of the part of the particulate material penetrating the exterior surface of the outer dough portion.

REFERENCES:
patent: 4511318 (1985-05-01), Kolodesh et al.

Affiliated with

Also associated with

Rating

Method for co-extrusing dough mass with particulate matter in th does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for co-extrusing dough mass with particulate matter in th, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for co-extrusing dough mass with particulate matter in th will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1083913