Method for closing holes in ceramic substrates

Details Method for closing holes in ceramic substrates Method for closing holes in ceramic substrates

1994-09-29

1996-02-13

Fiorilla, Christopher A.

Plastic and nonmetallic article shaping or treating: processes

Disparate treatment of article subsequent to working,...

Effecting temperature change

264 60, 264 61, 264234, 264259, B29C 7100

Patent

active

054909651

ABSTRACT:
A method for closing holes in a ceramic substrate may include the steps of filling the holes with a paste including a ceramic filler material and an alumina powder suspended in an organic carrier; firing the substrate at a temperature sufficient to burn off the organic carrier, but lower than the melting temperature of the ceramic sealing material; maintaining the substrate at the burn-off temperature for a time period sufficient to burn off substantially all of the organic carrier; raising the temperature of the ceramic substrate to a sealing temperature sufficient to melt the ceramic sealing material, but lower than the melting temperature of the ceramic stabilizing material; maintaining the ceramic substrate at the sealing temperature for a time period sufficient to allow the molten ceramic sealing material to fill interstices in the hole; and cooling the substrate.

REFERENCES:
patent: 4020206 (1977-04-01), Beil
patent: 4299873 (1981-11-01), Ogihara et al.

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