Method for cleaning workpieces by ultrasonic energy

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...

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Details

134 33, 134 34, B08B 312

Patent

active

041781880

ABSTRACT:
A delicate workpiece, such as a semiconductor wafer is cleaned by supporting the workpiece on a shaft which is rotated. A film of liquid solvent is caused to continuously flow across the exposed workpiece surface while the workpiece is in rotation and ultrasonic energy is applied to the liquid film for causing cavitation in the solvent, thereby effecting cleaning of the workpiece surface. Upon shutting off the solvent and the ultrasonic energy, the workpiece is dried by spinning it at high speed.

REFERENCES:
patent: 2828231 (1958-03-01), Henry
patent: 2980123 (1961-04-01), Lemelson
patent: 3577278 (1971-05-01), Rohr
patent: 3829328 (1974-08-01), Blustain
patent: 3849195 (1974-11-01), Powell et al.
patent: 4027686 (1977-06-01), Shortes et al.

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