Cleaning and liquid contact with solids – Processes – Combined
Patent
1997-07-16
1999-09-28
Ludlow, Jan
Cleaning and liquid contact with solids
Processes
Combined
134 2, 134 26, 134 34, 134 37, 134113, 216 38, 451 6, B08B 302
Patent
active
059581484
ABSTRACT:
The present invention provides methods and apparatus which permit the in-process, in-situ, substantially real time measurement of the actual thickness of a surface layer of a workpiece, e.g., a semiconductor wafer. A probe is disposed proximate the outer perimeter of a polishing pad on a CMP table such that the probe establishes optical contact with the wafer surface as a portion of the wafer extends beyond the outer perimeter of the polishing pad. A reflected signal received by the probe is analyzed to calculate the thickness of the surface layer. Alternatively, the reflective characteristics of the semiconductor layers may affect the nature of the reflected signal; changes in the reflected signal can be detected to indicate when a metallic layer has been removed from an oxide layer. In accordance with another aspect of the present invention, a nozzle assembly having a plurality of fluid outlets may be provided to apply a stream of deionized water at the surface under inspection to thereby remove excess slurry and debris from the local region of the workpiece being inspected. A second fluid nozzle may be provided to apply a stream of deionized water to the tip of the probe tip to thereby clean the probe tip between endpoint detection cycles. The nozzle assembly may also include a third fluid nozzle for applying a stream of nitrogen gas to thereby deflect debris away from the probe tip during the endpoint detection procedure and a fourth fluid nozzle for applying a stream of nitrogen gas to thereby remove water and debris from the probe tip during the endpoint detection procedure.
REFERENCES:
patent: 4307741 (1981-12-01), Rossi
patent: 4693038 (1987-09-01), Vetter
patent: 4768713 (1988-09-01), Roper
patent: 4989783 (1991-02-01), Douglas
patent: 5081796 (1992-01-01), Schultz
patent: 5433649 (1995-07-01), Nishida
Patent Abstracts of Japan, vol. 097, No. 010, Oct. 31, 1997 & JP 09 159409 (Dainippon Screen Mfg. Co., Ltd.), Jun. 20, 1997--see abstract.
Goudie Chad
Holzapfel Paul
Natalicio John
Yednak, III Andrew
Ludlow Jan
SpeedFam-IPEC Corporation
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