Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Patent
1995-04-19
1997-01-14
Warden, Jill
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
134 32, 134 33, 134184, 134902, B08B 312
Patent
active
055935052
ABSTRACT:
A method of cleaning a semiconductor wafer comprises placing liquid in a bath with a gas-liquid-interface defined at the surface of the liquid. A semiconductor wafer is placed in the bath so that it is oriented in a generally upright position with at least part of the wafer being in the liquid and below the gas-liquid-interface. Sonic energy is directed through the liquid. At least one of the position of the semiconductor wafer and the level of liquid in the bath relative to the semiconductor wafer is varied so that the entire surface of the wafer repeatedly passes through the gas-liquid-interface.
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Cyrus Glickstein, Acoustica Associates, Inc., "Basic Ultrasonics", Apr. 1960, p. 93.
Bartram Ronald D.
Chai Jing
Erk Henry F.
Hollander Eugene R.
Chaudhry Saeed
MEMC Electronic Materials , Inc.
Warden Jill
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