Method for cleaning semiconductor wafers with an external heat s

Details Method for cleaning semiconductor wafers with an external heat s Method for cleaning semiconductor wafers with an external heat s

1997-03-13

1999-11-30

Warden, Jill

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 1, 134902, B08B 700

Patent

active

059924292

ABSTRACT:
A method of cleaning semiconductor wafers by use of a heat source external to the system is disclosed. The semiconductor wafers are disposed within a vacuum chamber having a transmissive window, and a radiant heat source external to the chamber is applied so that the radiation passes through the window onto the semiconductor wafers. The invention has particular application to semiconductor wafers used for photocathodes and image intensifier tubes.

REFERENCES:
patent: 4871417 (1989-10-01), Nishizawa et al.
patent: 4877757 (1989-10-01), York et al.
patent: 5470266 (1995-11-01), Stanley et al.

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