Method for cleaning semiconductor wafers using liquified gases

Details Method for cleaning semiconductor wafers using liquified gases Method for cleaning semiconductor wafers using liquified gases

1995-05-04

1996-02-27

Lacey, David L.

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

134 21, 134 31, 134 33, 134902, B08B 312

Patent

active

054945267

ABSTRACT:
A semiconductor processing system (10) is provided that comprises a cleaning chamber (12) and a load lock wafer handler chamber (14). A cleaning agent (34) is placed in a cleaning bath chamber (28). A semiconductor substrate (16) is placed in contact with the cleaning agent (34). Cleaning agent (34) is initially in a liquid phase and is caused to change to a vapor phase so that the cleaning agent (34) can penetrate the topography of the surface to be cleaned. Cleaning agent (34) is then returned to a liquid phase and finally flash-evaporated to complete the cleaning process.

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Edward Bok, Dieter Kelch, Kevin S. Schumacher, "Supercritical Fluids for Single Wafer Cleaning," Solid State Technology, Jun. 1992, vol. 35, Issue 6, pp. 117-120.

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