Method for cleaning semiconductor wafers

Details Method for cleaning semiconductor wafers Method for cleaning semiconductor wafers

1993-06-29

1995-05-16

Lieberman, Paul

Cleaning and liquid contact with solids

Processes

With treating fluid motion

134 251, 134 254, 134 3, B08B 304

Patent

active

054156980

ABSTRACT:
A method for cleaning a substrate of the present invention, in which a plurality of substrates are placed substantially parallel with each other are dipped into a cleaning solution to remove particles adhering to each of the substrates, includes the step of dipping the substrates into the cleaning solution at a speed (V) through a surface of the cleaning solution, wherein the speed (V) for dipping the substrates into the cleaning solution, a minimum distance (l) among distances between the substrates, a length (L) of the substrates measured in a dip direction thereof, and a speed (v) at which the particles are transferred along the surface of the cleaning solution in a vertical direction with respect to back faces of the substrates satisfy the expression: lV.gtoreq.vL.

REFERENCES:
patent: 4375992 (1983-03-01), Stevens et al.
patent: 5071488 (1991-12-01), Takayama et al.

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