Method for cleaning semiconductor silicon wafer

Details Method for cleaning semiconductor silicon wafer Method for cleaning semiconductor silicon wafer

1995-08-14

1997-09-09

Warden, Jill

Cleaning and liquid contact with solids

Processes

For metallic, siliceous, or calcareous basework, including...

134 3, 134 26, 134 28, B08B 300

Patent

active

056651686

ABSTRACT:
A method for cleaning a semiconductor silicon wafer, which can suppress and reduce adhesion of particles to the surface of the wafer, is disclosed. The method includes the steps of cleaning the semiconductor silicon wafer by using hydrofluoric acid aqueous solution containing a surfactant, and thereafter rinsing the semiconductor silicon wafer by using pure water containing ozone.

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T. Isagawa et al., "Ultra Clean Surface Preparation Using Ozonized Ultrapure Water", International Conference on Solid State Devices and Materials, Aug. 26-28, 1992, Tokyo, Japan, pp. 193-195.

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