Cleaning and liquid contact with solids – Processes – Using solid work treating agents
Reexamination Certificate
2000-08-23
2001-08-14
El-Arini, Zeinab (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using solid work treating agents
C134S902000, C015S231000, C015S210100
Reexamination Certificate
active
06273961
ABSTRACT:
TECHNICAL FIELD
The present invention relates to a cleaning apparatus and a method of using the apparatus to reduce particles in semiconductor processing equipment. The present invention is particularly applicable in reducing particles in chemical vapor deposition equipment.
BACKGROUND ART
Current semiconductor manufacturing methodology requires “clean” processing environments that are relatively free of particle contamination. Generally, all semiconductor manufacturing steps are performed in a clean room in which the air is continuously filtered to remove particles. Unwanted particles introduced onto wafers can cause improperly defined features, undesirable surface topography, leakage through various insulating layers and other problems affecting circuit reliability. In a worst case scenario, particles introduced into the manufacturing environment can result in an unusable product causing the loss of considerable manufacturing time and costs.
During certain steps in the manufacturing process, the elimination of particles is more critical to producing a reliable product. For example, eliminating particles during chemical vapor deposition (CVD) process steps is critical to producing a reliable product. CVD equipment typically includes a loadlock chamber for loading wafers to be processed.
The loadlock chamber is connected to a process chamber where various chemical films are deposited onto the surface of the wafers. If the number of particles introduced into the process at this step is too high, the wafers may be rendered unusable.
Extreme care is typically taken to avoid the introduction of contaminants into the CVD process chamber. For example, complex cleaning routines, such as those disclosed in U.S. Pat. No. 5,607,515, are conventionally used to ensure that the number of particles in the process chamber are kept to a minimum.
A drawback with these conventional cleaning procedures is that they are time consuming and costly in a manufacturing environment. Another drawback with such procedures is that only the process chamber is cleaned, with no attention given to the loadlock chamber.
More particularly, conventional CVD loadlock chambers often include a cooling station for cooling the wafers after the chemical deposition in the process chamber. The cooling station typically contains areas that are relatively inaccessible to the human hand.
The loadlock chamber is not typically considered a major source of contaminants because it is not directly involved in the chemical deposition. In addition, the inaccessible parts of the equipment are generally not cleaned due to the belief that these parts are relatively immune from outside contamination. Therefore, the inaccessible parts of the loadlock cooling station are not cleaned to the degree required to reduce particles.
SUMMARY OF THE INVENTION
There exists a need for a device for cleaning semiconductor equipment in an efficient, cost-effective manner.
There is also a need for a method for cleaning semiconductor equipment in an efficient, cost-effective manner.
These and other needs are met by the present invention, where a cleaning device is used for cleaning semiconductor processing equipment. The cleaning device includes a handle containing slots to secure a cleaning wipe for cleaning the semiconductor equipment. In certain embodiments, the cleaning device is configured for insertion into areas that are difficult to clean.
According to one aspect of the invention, a device for cleaning semiconductor processing equipment is provided. The device includes a handle having a first end and a second end. The device also includes a plurality of slots located on the first end of the handle The plurality of slots are configured for affixing a cleaning wipe to the handle.
Another aspect of the present invention provides a method for cleaning a semiconductor processing device using a cleaning handle having a first end and a second end. The method includes affixing a cleaning wipe to the first end of the handle. The method also includes wrapping the cleaning wipe around the first end of the handle and wiping the semiconductor processing device.
Other objects and advantages of the present invention will become readily apparent to those skilled in this art from the following detailed description. The embodiments shown and described provide illustration of the best mode contemplated for carrying out the invention. The invention is capable of modifications in various obvious respects, all without departing from the invention. Accordingly, the drawings are to be regarded as illustrative in nature, and not as restrictive.
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Fernando Cesar R.
Patel Narendra
Advanced Micro Devices , Inc.
El-Arini Zeinab
LandOfFree
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