Method for cleaning semiconductor equipment

Details Method for cleaning semiconductor equipment Method for cleaning semiconductor equipment

2011-04-26

2011-04-26

Barr, Michael (Department: 1711)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C134S022100, C166S067000, C438S905000

Reexamination Certificate

active

07931752

ABSTRACT:
A method for cleaning a semiconductor equipment is provided. First, a first cleaning step is performed to the process chamber. The first cleaning step includes conducting a cleaning gas into the process chamber via a short processing gas injector for generating a plasma of the cleaning gas in the process chamber. Then, a cleaning step is performed to a long cleaning gas injector. The cleaning step performed to the long cleaning gas injector includes conducting the cleaning gas into the process chamber via the long processing gas injector. Then, a second cleaning step is performed to the process chamber. The second cleaning step includes conducting the plasma of the cleaning gas into the process chamber via the short processing gas injector.

REFERENCES:
patent: 6200412 (2001-03-01), Kilgore et al.
patent: 7055212 (2006-06-01), Blanco-Rivera et al.
patent: 2002/0195124 (2002-12-01), Chin et al.

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