Method for cleaning raised terminal pads of semiconductor elemen

Details Method for cleaning raised terminal pads of semiconductor elemen Method for cleaning raised terminal pads of semiconductor elemen

1977-12-29

1979-05-01

Caroff, Marc L.

Cleaning and liquid contact with solids

Processes

Using solid work treating agents

29590, 51326, 51328, B08B 100

Patent

active

041521722

ABSTRACT:
Method and apparatus for cleaning the top surfaces of raised input/output (I/O) terminals of semiconductor elements of a semiconductor wafer prior to electronic leads being reflow bonded to such terminals. The top surfaces of the I/O terminals substantially lie in I/O plane. The wafer is mounted on a work handler and the handler is fixedly mounted on a vacuum plate holder which is mounted for oscillatory movement in a plane at a predetermined amplitude and frequency. A vinyl eraser having a planar surface of greater area than the area of the wafer occupied by the elements is mounted directly above the wafer. The eraser is operatively connected to an actuator which presses the planar surface of the eraser against the top surfaces of the I/O terminals with a predetermined force. Oscillation of the work handler holder with respect to the eraser for a predetermined time causes the top surfaces of the I/O terminals to rub against the planar surface of the eraser, which cleans them without the eraser contacting the upper surface of the semiconductor elements or damaging the I/O terminals, and results in the I/O terminals being ready to be reflow bonded to electronic leads without further preparation.

REFERENCES:
patent: 2015603 (1935-09-01), Maris
patent: 4024596 (1977-05-01), Rioux

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