Method for cleaning polysilicon

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S906000

Reexamination Certificate

active

07067428

ABSTRACT:
A method for cleaning polysilicon comprises steps of cleaning solid or granular polysilicon with an aqueous solution of dissolved ozone, and of cleaning with hydrofluoric acid the polysilicon receiving the above cleaning based on an aqueous solution of dissolved ozone, wherein the above steps are executed once in this order, or the above steps are repeated once or more in this order. Subsequent to the last cleaning step using hydrofluoric acid, a still other step of cleaning the polysilicon with pure water and then drying it is preferably added.This method for cleaning polysilicon allows organic materials, particles and metal impurities adsorbed on the surface of polysilicon to be removed at a low cost, and to increase the freeing rate.

REFERENCES:
patent: 5904574 (1999-05-01), Nishijima
patent: 6100198 (2000-08-01), Grieger et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for cleaning polysilicon does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for cleaning polysilicon, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for cleaning polysilicon will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3622210

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.