Method for cleaning and regenerating a mold

Details Method for cleaning and regenerating a mold Method for cleaning and regenerating a mold

2004-09-15

2008-09-30

Hug, Eric (Department: 1791)

Plastic and nonmetallic article shaping or treating: processes

With step of cleaning, polishing, or preconditioning...

C134S008000, C134S022180, C134S024000

Reexamination Certificate

active

07429342

ABSTRACT:
A cleaning substrate for cleaning and regenerating a mold is disclosed. The mold is contaminated after repeatedly packaging the semiconductor device by making use of thermosetting resin. At least a protrusion of the substrate can substantially match with and be contained within the edges of the mold cavity of the mold when the cleaning substrate is placed in the mold.

REFERENCES:
patent: 3575764 (1971-04-01), McFarren
patent: 4935175 (1990-06-01), Kitaura et al.
patent: 6077360 (2000-06-01), Takashima
patent: 1-95010 (1989-04-01), None
patent: 4-173117 (1992-06-01), None

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