Method for cleaning and drying semiconductors

Cleaning and liquid contact with solids – Processes – Gas or vapor condensation or absorption on work

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Details

134 37, 134 42, 134105, B08B 704, B08B 500

Patent

active

041860322

ABSTRACT:
A semiconductor wafer is cleansed of loose foreign surface matter and chemical impurities near the surface in an apparatus which passes superheated steam over the wafer. Condensate is permitted to form and drip off the wafer. After rising above 100.degree. C. the wafer becomes dry, and is removed from the apparatus and then permitted to cool.

REFERENCES:
patent: 2820728 (1958-01-01), Burns
patent: 2956911 (1960-10-01), Jelen
patent: 3084076 (1963-04-01), Louks et al.
patent: 3120454 (1964-02-01), Bailey et al.
patent: 3281915 (1966-11-01), Schramm
patent: 3410724 (1968-11-01), Kondrot
patent: 3802918 (1974-04-01), Landwier
"Wafer Cleaner System", Moreau and Schmidt, IBM Technical Disclosure Bulletin, vol. 14, No. 10 (Mar. 1972).
"Cleanliness and the Cleaning of Silicon Wafers", J. A. Amick, Solid State Technology, vol. 19, No. 11, Nov. 1976, pp. 47-52.

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