Method for cleaning and drying a semiconductor wafer

Details Method for cleaning and drying a semiconductor wafer Method for cleaning and drying a semiconductor wafer

1995-05-09

1996-11-05

El-Arini, Zeinab

Cleaning and liquid contact with solids

Processes

Work handled in bulk or groups

134 255, 134 26, 134 30, 134902, 134 37, B08B 304

Patent

active

055713378

ABSTRACT:
A method for drying articles with flat surfaces such as a semiconductor wafer. The method includes steps of immersing a semiconductor wafer in a liquid such as water, and displacing the liquid with a gaseous mixture. The liquid is displaced adjacent to a face of the wafer as measured from the face. A step of pulsing drying fluid directed at wafer edges is also included. The method dries wafers without the use of any harmful organic solvents and the like, and also dries wafers without substantial movement.

REFERENCES:
patent: 4633893 (1987-01-01), McConnell et al.
patent: 4750505 (1988-06-01), Inuta et al.
patent: 4778532 (1988-10-01), McConnell et al.
patent: 4871417 (1989-10-01), Nishizawa et al.
patent: 4874014 (1989-11-01), Grant et al.
patent: 4911761 (1990-03-01), McConnell et al.
patent: 4917123 (1990-04-01), McConnell et al.
patent: 4984597 (1991-01-01), McConnell et al.
patent: 4987687 (1991-01-01), Sugimoto
patent: 5082518 (1992-01-01), Molinaro
patent: 5129955 (1992-07-01), Tanaka
patent: 5143103 (1992-09-01), Basso et al.
patent: 5156174 (1992-10-01), Thompson et al.
patent: 5169408 (1992-12-01), Biggerstaff et al.
patent: 5228206 (1993-07-01), Grant et al.
patent: 5271774 (1993-12-01), Leenaars et al.
patent: 5286657 (1994-02-01), Bran
patent: 5421905 (1995-06-01), Ueno et al.
D. J. Riley and R. G. Carbonell, "The Deposition of Contaminants from Deionized Water onto Hydrophobic Silicon Wafers", Journal of the IES, pp. 28-34, Nov./Dec. 1991.
N. D. Casper and B. W. Soren, "Semiconductor Yield Enhancement through Particle Control", Emerging Semiconductor Technology, pp. 423-435 No Date.
M. Itano, F. W. Kern, Jr., R. W. Rosenberg, M. Miyashita, I. Kawanabe, and T. Ohmi, "Particle Deposition and Removal in Wet Cleaning Processes for ULSI Manufacturing", IEEE Trans. on Semiconductor Manufacturing, vol. 5, No. 2, pp. 114-120, May 1992.
Y. Yagi, T. Imaoka, Y. Kasama, and T. Ohmi, "Advanced Ultrapure Water Systems with Low Dissolved Oxygen for Native Oxide Free Wafer Processing", IEEE Trans. On Semiconductor Manufacturing, vol. 5, No. 2, pp. 121-127, May 1992.
H. G. Parks, J. F. O'Hanlon, and F. Shadman, "Research Accomplishments at the University of Arizona Sematech Center of Excellence for Contamination/Defect Assessment and Control", IEEE Trans. on Semiconductor Manufacturing vol. 6. No. 2, pp. 134-142, May 1993.
C. S. Ackerman and J. M. Fabia, "Monitoring Supplier Quality at PPM Levels", IEEE Trans. on Semiconductor Manufacturing, vol. 6. No. 2, pp. 189-194, May 1993.
G. D. Moss, J. N. DiBello, K. P. Yanders, and R. F. Orr, "Capillary Drying: Particle-Free Wet-Process Drying?" No Date.
T. Ohmi, Ultra Clean Technology Handbook, p. 290, 1993.
J. Marra, "Ultra Clean Marangoni Drying", pp. 269-282 No Date.
C. McConnell, "Examining the Effects of Wafer Surface Chemistry on Particle Removal Using Direct-Displacement Isopropyl Alcohol Drying", MicroContamination, Feb. 1991.
P. Burggraaf, "Keeping the `RCA` in Wet Chemistry Cleaning", Semiconductor International, pp. 86-90, Jun. 1994.
M. B. Olesen, "A Comparative Evaluation of the Spin Rinser/Dryer with the IPA Vapor Isodry Technique", Proceedings-Institute of Environmental Sciences, pp. 229-241, 1990.

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