Method for cleaning an object soldered with a lead-containing so

Details Method for cleaning an object soldered with a lead-containing so Method for cleaning an object soldered with a lead-containing so

1996-07-25

1999-01-26

El-Arini, Zeinab

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

10 38, 10 40, 10 42, 210689, B08B 304, B08B 308, B01D 1504

Patent

active

058633510

ABSTRACT:
Minute quantities of water in a terpene cleaning solvent cause a reaction with certain metals, particularly lead, tin and copper, which reactions are responsible for corrosion of the metal. Such reactions can be reduced or substantially eliminated by exposing the cleaning solvent to a molecular sieve prior to the cleaning operation. The molecular sieve typically includes a plurality of beads of zeolite to which the cleaning solvent is exposed. The molecular sieve traps the water molecules from the solvent so that, after treatment, the solvent contains substantially no water molecules.

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"Aqueous and Semi-Aqueous Cleaning Processes," G.M. Wenger et al., AT&T Technical Journal Vol. 71, No. 2, Mar./Apr, 1992, pp. 45-51.
"The Encyclopedia of Chemistry," Third Edition, edited by C.A. Hampel and G.G. Hawley, Van Nostrand Reinhold Company, New York et al., 1973, pp. 685-687 No Month.

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