Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2005-05-24
2005-05-24
Barr, Michael (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S002000, C134S003000, C134S029000
Reexamination Certificate
active
06896744
ABSTRACT:
A highly efficient method for cleaning a substrate, whereby in the cleaning of the substrate, {circle around (1)} in a short time, {circle around (2)} both particle contaminants and metal contaminants can be removed, and {circle around (3)} a problem associated therewith, such as re-deposition of contaminants or a dimensional change due to etching, can be remarkably reduced, and which has the following characteristics.A method for cleaning a surface of a substrate, which comprises at least the following steps (1) and (2), wherein the step (2) is carried out after carrying out the step (1):Step (1): A cleaning step of cleaning the surface of the substrate with an alkaline cleaning agent containing a completing agent, andStep (2): A cleaning step employing a cleaning agent having a hydrofluoric acid content C (wt %) of from 0.03 to 3 wt %, wherein the cleaning time t (seconds) of the substrate with said cleaning agent is at most 45 seconds, and C and t satisfy the relationship of 0.25≦tC1.29≦5.
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Mochizuki Hideaki
Morinaga Hitoshi
Barr Michael
Chaudhry Saeed
Mitsubishi Chemical Corporation
Oblon & Spivak, McClelland, Maier & Neustadt P.C.
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