Method for cleaning a semiconductor wafer

Details Method for cleaning a semiconductor wafer Method for cleaning a semiconductor wafer

1998-07-27

2000-05-09

Gulakowski, Randy

Cleaning and liquid contact with solids

Processes

With treating fluid motion

134 21, 134 32, 134 33, 134 34, 134902, 15303, 153092, 15345, B08B 704, B08B 504

Patent

active

06059893&

ABSTRACT:
A semiconductor cleaning method for removing particles that have adhered to the back side of a semiconductor wafer. The semiconductor wafer is placed on a support. Inert gas is blown against the back of the semiconductor wafer by a plurality of nozzles, each of which is positioned at a predetermined angle to the back of the semiconductor wafer and inclined in a first direction. An air exhaust is located near the periphery of the semiconductor wafer and arranged so as to suck in the particles removed from the semiconductor wafer with the nozzles.

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