Cleaning and liquid contact with solids – Processes – Using sequentially applied treating agents
Reexamination Certificate
2007-04-10
2007-04-10
Barr, Michael (Department: 1746)
Cleaning and liquid contact with solids
Processes
Using sequentially applied treating agents
C134S031000, C438S905000
Reexamination Certificate
active
10734479
ABSTRACT:
Disclosed are a method for cleaning a deposition chamber by removing attached metal oxides, and a deposition apparatus for performing in situ cleaning. A first gas and a second gas are provided into the deposition chamber. The first gas is reacted with metal included in the metal oxide to generate reacting residues. The second gas then decomposes the reacting residues, and the decomposed residues are exhausted out of the chamber. Thus, this cleaning process can be rapidly accomplished while the deposition chamber is not opened or separated from a deposition apparatus.
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English language Abstract from Japanese Patent Publication No. JP11222679 published Aug. 17, 1999.
Choi Han-Mei
Kim Kyoung-Seok
Park In-Sung
Park Young-Wook
Yim Eun-Taek
Barr Michael
Chaudhry Saeed
Marger & Johnson & McCollom, P.C.
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