Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate
2005-02-15
2005-02-15
Chaudhari, Chandra (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including contaminant removal or mitigation
C438S906000
Reexamination Certificate
active
06855576
ABSTRACT:
The present invention provides a method for cleaning a ceramic member for use in a system for producing semiconductors. The method has the step of cleaning the ceramic member with an organic acid or a weak acid. Preferably, the ceramic member is cleaned with a strong acid before the cleaning with an organic acid or a weak acid. The ceramic member may be subjected to a blasting treatment before the cleaning with an organic acid or a weak acid. According to the method, the amount of metal transferred from the ceramic member to a semiconductor may be considerably reduced.
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Kiku Taiji
Kondou Nobuyuki
Yamaguchi Shinji
Burr & Brown
Chaudhari Chandra
NGK Insulators Ltd.
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