Method for cleaning a bonding tool used on covered bonding wires

Details Method for cleaning a bonding tool used on covered bonding wires Method for cleaning a bonding tool used on covered bonding wires

1996-11-22

1998-10-06

Ryan, Patrick

Metal fusion bonding

Process

With subsequent treating other than heating of bonded parts...

228205, 2281805, 219 5622, B23K 3102, B23K 3700

Patent

active

058164804

ABSTRACT:
A method for cleaning a bonding tool of a bonding apparatus includes a step of positioning a tip portion of the bonding tool between a pair of discharge electrodes, which are primarily used for removing a covering that covers a bonding wire, and a step of causing an electrical discharge across the discharge electrodes by applying a high voltage, such as of 3500 V, by connecting the discharge electrodes to positive and negative poles of a discharge power source, respectively. The electrical discharge is performed with the bonding wire kept inside the bonding tool so as not to project out of the bonding tool or after the bonding wire is removed from the bonding tool.

REFERENCES:
patent: 5176310 (1993-01-01), Akiyama et al.
patent: 5285949 (1994-02-01), Okikawa et al.
patent: 5370300 (1994-12-01), Okumura
patent: 5545868 (1996-08-01), Ohmi et al.

Affiliated with

Also associated with

Rating

Method for cleaning a bonding tool used on covered bonding wires does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for cleaning a bonding tool used on covered bonding wires, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for cleaning a bonding tool used on covered bonding wires will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-70023