Data processing: measuring – calibrating – or testing – Measurement system – Temperature measuring system
Reexamination Certificate
2002-03-28
2004-12-07
Barlow, John (Department: 2863)
Data processing: measuring, calibrating, or testing
Measurement system
Temperature measuring system
C702S120000, C714S718000, C324S073100, C324S760020
Reexamination Certificate
active
06829554
ABSTRACT:
FIELD OF INVENTION
The invention relates to a method for checking the functional capacity and operating characteristics of semiconductor components.
RELATED APPLICATIONS
This application claims the benefit of the priority date of German application 101 15 280.9, filed on Mar. 28, 2001, the contents of which are herein incorporated by reference.
BACKGROUND
Semiconductor components are tested with respect to their functional capacity. When the elements are being tested, both the temperature of the test environment and the maximum achievable operating speed of the semiconductor component are measurement parameters. In a first step, the so-called “low temp program”, at a low temperature of e.g. −10° C., the semiconductor components are allocated to various categories with respect to their maximum achievable operating speed at the low temperature, and are distributed, in a handler, to various bins (containers). In this way, a plurality of bins with different speed classes are produced. The total number of all the semiconductor components distributed throughout the various bins may in this case lie between 5000 and 20,000.
In a second step, the various bins of semiconductor components are delivered individually to a “high temp program.” In the “high temp program,” they are re-tested with essentially the same procedures as in the “low temp program,” but this time at a higher temperature of e.g. +85° C.
At the end of the two measurement procedures, the components are divided up into speed categories, with the components of a given category achieving a particular operating speed throughout the temperature range.
A disadvantage of this prior method is that the sorted components must not be mixed again after the low temp measurement. This entails considerable logistical complexity, since the individual bins need to be transported independently of one another, intermediately stored and tested separately in the “high temp program.” Furthermore, one container needs to be disconnected and another needs to be connected up each time a new bin of semiconductor components is being docked to the test station for testing at a higher temperature. This results in a longer loading time for the handler and extra work for the operator. Furthermore, it is not possible to preclude the possibility that the individual bins may mistakenly be interchanged when an operator intervenes in the process.
SUMMARY
It is an object of the invention to provide a method which obviates the need for transportation and intermediate storage of semiconductor components that differ from one another only in terms of their maximum achievable operating speed, and which permits sorting of the components without human intervention.
The basic concept for achieving the foregoing object is to sort the components only logically according to speed classes in the “low temp program,” without physically separating them from one another As a result, all the components are contained in one bin afterward, just as they were before. The distinction between the components is made by using information that is saved for each individual component in a file during the first test procedure, the “low temp program.” The main aspect of the information about each component is the speed class to which it belongs. In addition, it is possible to store other parameters of the test measurement, such as e.g. the bin number, measuring instrument and the temperature. The file with the information about the different speed classes is saved on a server. The correlation between the data in the file on the server and the individual component is made possible by using the identification of the component. This identification is programmed into the component in a way that precludes erasure or alteration, and which is likewise stored in this file. During the “high temp” program, the file is imported and compared with the currently read chip identifications of the components. The information relating to the speed classes of the components from the “low temp program” and from the “high temp program” is subsequently combined, and only then are the components physically sorted.
The method on which the invention is based for classifying components includes recording a maximum achievable operating speed of each component at at least two temperature values, and allocating each component to a speed category as a function of the operating speed achieved by the component at the at least two temperature values.
In some practices of the invention, the following steps are carried out: reading the identification for each component, storing the operating speed achieved at a first temperature value in conjunction with the read identification for each component as an entry in a file in a database, repeating the preceding step for each further one of the at least two temperature values, and allocating each component to a speed category as a function of the operating speeds stored in the file in the database.
Preferably, the first of the at least two temperature values is the lowest temperature value, and each of the subsequent temperature values is higher than the temperature value preceding it.
In a preferred embodiment of the invention, the allocation of the component to one of the speed categories is carried out by determining the minimum of the operating speeds achieved at all of the at least two temperature values.
Other features and advantages of the invention are disclosed in the following description of a preferred exemplary embodiment.
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Infineon Data Sheet for HYB25D256400/800T/AT.SDRAM, Nov., 2000.
Dueregger Reinhard
Gupta Kapil
Ruf Wolfgang
Sickmoeller Markus
Barlow John
Fish & Richardson P.C.
Infineon - Technologies AG
Vo Hien
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