Method for circuits connection for wafer level burning and testi

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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3241581, 437 8, G01R 3128, H01L 2166

Patent

active

054831750

ABSTRACT:
Integrated circuit devices on a wafer are tested by the use of test circuit on the integrated circuit devices which is connected by means of a grid. The grid is used to enable the test circuitry, and provides an ability to test the devices while still on the wafer. This facilitates burning in the wafer prior to singulating the parts, since it is not necessary to separately establish electrical connections at contact points on the individual integrated circuit devices. In one embodiment, an oscillator may be adjusted in speed so that further tests may be effected by changing a test speed through the test circuit. Response of the integrated circuits at different operating speeds is determined by the adjustment of the oscillator speed so that a timing signal used for the testing may be varied.

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patent: 5307010 (1994-04-01), Chiu

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