Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
Patent
1993-12-28
1995-10-31
Chaudhuri, Olik
Etching a substrate: processes
Forming or treating electrical conductor article
Forming or treating of groove or through hole
437226, 437227, 148DIG28, 216 22, B44C 122, H01L 21306, C03C 1500
Patent
active
054626366
ABSTRACT:
A method for creating scribe lines on a wafer having an electronic device constructed therein. A plurality of boundary segments is formed on the wafer to define a region on the wafer. This region encompasses the electronic device. An insulating layer is formed over the boundary segments, wherein the insulating layer covers the electronic device. A portion of the insulating layer is removed such that each of the segments is exposed. The boundary segments are then etched away to expose the wafer and form a plurality of scribe lines, wherein the wafer may be cut at the scribe lines to separate the electronic device from the wafer while minimizing damage to the electronic device.
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Chen George Y.
Lee Edward H. P.
Chaudhuri Olik
Dillon Andrew J.
International Business Machines - Corporation
Tsai H. Jey
Wilson James C.
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