Method for chemical vapor deposition under a single reactor vess

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 55, 427 70, 4272553, 4272555, 427314, 427402, 118319, B05D 306

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active

050716700

ABSTRACT:
A method provides a sequential continuous vapor deposition process comprising a plurality of steps for depositing a predetermined material upon a surface of a substrate mounted for relative movement within a reactor vessel between each of a plurality of gas emitters disposed within the vessel for separately and continuously emitting predetermined gases, each gas emitter having an exhaust port associated therewith for exhausting the said gas emitted by the said gas emitter from the reactor vessel, the method comprising the steps of: separating each of the plurality of gases within the reactor vessel by establishing pressure differences at each of said gas emitters, moving the substrate to pass immediately adjacent to a first one of said plurality of gas emitters for exposing the substrate to a first one of said gases in order to carry out a first step of the vapor deposition process and, moving the substrate to pass immediately adjacent to a second one of said plurality of gas emitters for exposing the substrate to a second one of said gases to carry out a second step of the vapor deposition process, so that the steps of the vapor deposition process are carried out sequentially by moving the substrate among the plurality of gas emitters.

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