Method for chemical vapor deposition of semiconductor films by s

Coating processes – Coating by vapor – gas – or smoke

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427255, 4272552, C23C 1644

Patent

active

057284253

ABSTRACT:
A method and apparatus in which separate steps are used between feeding source gases and growing films in a process of chemical vapor deposition (CVD) for compound semiconductor films. In one embodiment, a CVD reactor chamber has a piston which can change the volume of the chamber to control the pressure of the source gases therein. After source gases are fed to the chamber having a substrate under the condition that no CVD takes place due to an insufficient vapor pressure, the chamber is kept closed for a few seconds, and then pressurized by the piston to start CVD. A typical result indicates that a Hg.sub.1-x Cd.sub.x Te (where x=0.2) film on a 3-inch CdTe wafer has only 1% (or .DELTA.x=0.002) inhomogeneity in composition.

REFERENCES:
patent: 4436580 (1984-03-01), Boyd et al.
patent: 4886683 (1989-12-01), Hoke et al.
patent: 4904337 (1990-02-01), Elliott et al.
patent: 4933207 (1990-06-01), Jensen et al.
patent: 4946543 (1990-08-01), Kalisher et al.
patent: 5015330 (1991-05-01), Okumura et al.
patent: 5017404 (1991-05-01), Paquet et al.
patent: 5151305 (1992-09-01), Matsumoto et al.
patent: 5194406 (1993-03-01), Bok et al.
patent: 5230925 (1993-07-01), Ohmine

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for chemical vapor deposition of semiconductor films by s does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for chemical vapor deposition of semiconductor films by s, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for chemical vapor deposition of semiconductor films by s will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-955647

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.