Abrading – Precision device or process - or with condition responsive... – Computer controlled
Reexamination Certificate
2005-04-26
2005-04-26
Nguyen, George (Department: 3725)
Abrading
Precision device or process - or with condition responsive...
Computer controlled
C451S010000, C451S041000, C700S097000, C700S121000
Reexamination Certificate
active
06884147
ABSTRACT:
A method for planarizing the surface of a semiconductor wafer or device during manufacture. Dependencies of polish rate and substrate thickness on process parameters of downforce and polish speed, and on the characteristic product high feature area on the wafer, are explicitly defined and used to control Chemical-Mechanical Polish in Run-to-Run and real-time semiconductor production control applications.
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Milks, III William C.
Nguyen George
Russo & Hale LLP
Yield Dynamics, Inc.
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