Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2005-04-05
2005-04-05
Nguyen, Dung Van (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S036000
Reexamination Certificate
active
06875087
ABSTRACT:
A method is provided for planarizing/polishing and subsequently in situ cleaning a surface of a work piece such as a semiconductor wafer. The method includes the steps of planarizing/polishing the surface of a work piece by subjecting a work piece surface to a chemical mechanical planarization/polishing (CMP) process on a chemical mechanical planarization/polishing platen such that the planarization/polishing process leaves the surface of the work piece hydrophobic. The planarization/polishing process is followed by a chemical mechanical cleaning (CMC) process in which the planarized/polished surface of the work piece is subjected to the cleaning process on the same chemical mechanical planarization/polishing platen such that the cleaning process leaves the surface of the work piece hydrophilic.
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Epshteyn Yakov
Mitchel Marie
Shartel, II John L.
Ingrassia Fisher & Lorenz PC
Nguyen Dung Van
Novellus Systems Inc.
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