Method for checking the quality of a wedge bond

Details Method for checking the quality of a wedge bond Method for checking the quality of a wedge bond

2006-07-25

2006-07-25

Edmondson, Lynne R. (Department: 1725)

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

C228S102000, C228S180500

Reexamination Certificate

active

07080771

ABSTRACT:
A method for checking the quality of a wedge bond between a wire loop and a connection point on a substrate, whereby the wire loop was formed by means of a capillary of a Wire Bonder, is characterised by the following steps:Placing the capillary at a side of the wire loop and next to the wedge bond, whereby the tip of the capillary is located below the level of the wire loop.Moving the capillary parallel to the surface of the substrate and orthogonally to the wire loop until the wedge bond tears away from the connection point or the wire breaks, and simultaneously measuring a signal that is a measure for a force exerted by the capillary on the wire loop, andDetermining the maximum of the measured signal.

REFERENCES:
patent: 4040885 (1977-08-01), Hight et al.
patent: 5591920 (1997-01-01), Price et al.
patent: 5894981 (1999-04-01), Kelly
patent: 2004/0079790 (2004-04-01), Mayer et al.
patent: 2004/0226983 (2004-11-01), Walther

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