Method for characterizing solder compositions

Optics: measuring and testing – With sample preparation

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Details

228104, 356237, 436 2, 436164, G01N 2188, B23K 100

Patent

active

044914121

ABSTRACT:
The present method can determine the presence and amount of silvery white metallic impurities in a silvery white molten solder composition. In accordance with the method of this invention, a transparent substrate which has sequential layers of metal deposited on one of the surfaces thereof is prepared. A first layer is formed directly on the substrate of a thin film of a colored metal such as copper or gold. A second thicker layer of a silvery white metal, the presence and amount of which is desired to be evaluated in the solder composition, deposited over the first layer. In use, the substrate is placed in contact with the molten solder. The amount of time required for the second layer to dissolve into the solder bath and the exposed first colored layer to change color due to alloying with the metal of the solder, is measured. The time required for the color change to occur is correlated to the level of contamination of the silvery white metal in the solder bath.

REFERENCES:
patent: 4409333 (1983-10-01), Tosima et al.

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