Method for characterizing failed circuits on semiconductor wafer

Details Method for characterizing failed circuits on semiconductor wafer Method for characterizing failed circuits on semiconductor wafer

1992-02-03

1993-08-31

Thomas, Tom

Fishing, trapping, and vermin destroying

H01L 2166

Patent

active

052408663

ABSTRACT:
Failed circuits (e.g., defects) on each of a plurality of semiconductor wafers (10) in a batch can be characterized for the purpose of identifying defect sources by first mapping the defective ones of the circuits (12.sub.1 -12.sub.n) in each wafer. A determination is made to see if the defects in the defect pattern map associated with each wafer (10) are sufficiently clustered to warrant further study. The defect pattern maps for the wafers in the batch identified as having spatial clustering present are smoothed and thresholded to identify where spatial clusters occur. All such smoothed and thresholded defect pattern maps are separated into groups in accordance with the pattern of defects. The pattern of defects associated with each group is then analyzed to determine if any relationship exists between the pattern and the order of the process steps or one of the patterns in a library of patterns associated with particular failure modes. Should a match be found, then the particular process step(s) or failure mode(s) responsible for such defects can be indicted.

REFERENCES:
patent: 4855253 (1989-08-01), Weber
W. Taam and M. Hamada, "Detecting Spatial Effects from Factorial Experiments: An Application in Integrated-Circuit Manufacturing," IIQP Research Report RR-90-02, 23 pp., Apr. 1990, University of Waterloo, Waterloo, Ontario, Canada.
P. A. P. Moran, "The Interpretation of Statistica. Maps," Journal of Royal Statistical Society, Series B, vol. 10, pp. 243-251 (1948).
P. V. Krishna Iyer, "The Theory of Probability Distributions of Points on a Lattice," Annals of Mathematical Statistics, vol. 21, pp. 198-217 (1950), Univ. of Oxford.

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