Method for chamfering the notch of a notch-cut semiconductor waf

Details Method for chamfering the notch of a notch-cut semiconductor waf Method for chamfering the notch of a notch-cut semiconductor waf

1988-09-29

1990-03-06

Olszewski, Robert P.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51283E, 5116577, B24B 906

Patent

active

049054252

ABSTRACT:
A notch-cut semiconductor wafer whose notch has its both corners entirely chamfered, and an apparatus and method for chamfering the notch as such, which employs a positioning device for positioning the wafer such that the notch of the wafer points in a predetermined direction; a conveyor device for conveying the wafer to a chamfering position; a holding device for holding the wafer to bring the wafer to arbitrary places; an abrasive wheel having an edge which is shaped like the notch; a driving device for driving the abrasive wheel; and a mechanism for controllingly moving at least one of the two items consisting of the abrasive wheel and the semiconductor wafer, to arbitrary places.

REFERENCES:
patent: 342789 (1886-06-01), Fenton
patent: 1133515 (1915-03-01), Uhlemann
patent: 1196294 (1916-08-01), Sanderson
patent: 1282022 (1918-10-01), Baker et al.
patent: 2971408 (1961-02-01), Robinson
patent: 4800686 (1989-01-01), Hirabayashi et al.

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