Method for calibrating surface mounting processes in printed cir

Optics: measuring and testing – By alignment in lateral direction – With registration indicia

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Details

356399, 356400, 356243, 738658, G01B 1100, G01J 102, G06K 900, H01L 2166

Patent

active

059780932

ABSTRACT:
A method and apparatus for calibrating surface mounting processes in the manufacturing of printed circuit board assemblies. In one embodiment of a method in accordance with the invention, a test pad of adhesive is deposited onto a substrate, and then a test module is mounted to the substrate at the test pad. The test module is representative of an electrical component that is to be mounted to a printed circuit board, and the test module is mounted to the substrate in a manner in which the electrical component is to be mounted to a printed circuit board. After the test module is mounted to the substrate, the profile of the test pad is detected through the substrate and/or the test module to determine whether the test pad contacts enough of the test module to sufficiently adhere the test module to the substrate without interfering with the terminals of the test module. Accordingly, this embodiment of the inventive method provides an indication or estimate of the desired volume of an adhesive pad to mount a specific component to a PCB.

REFERENCES:
patent: 4636073 (1987-01-01), Williams
patent: 5237622 (1993-08-01), Howell
patent: 5247844 (1993-09-01), Howell
patent: 5455870 (1995-10-01), Sepai et al.
patent: 5537204 (1996-07-01), Woodhouse
patent: 5662763 (1997-09-01), Yamanaka

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